0.80mm spacing, micro thin high-speed data transmission board to board
0.80mm spacing, micro thin high-speed data transmission board to board
0.80mm spacing, micro thin high-speed data transmission board to board
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Product details
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Product Introduction
Specification: 28P, 56P, 84P, Height: 5.00mm, 8.00mm, 11.00mm

Specification: 28P, 56P, 84P
Insulation material: LCP
Electroplating: Gold plating on Max 50u nickel
Rated current:
Signal: 1.30A per pin@95 °C
Grounding: 10.1A per pin@95  °C
Rated voltage: 225VAC
Height: 5.00mm, 8.00mm, 11.00mm
Maximum friction distance: 0.56mm
Working range: -55 ° C-125 ° C
Coplanarity: 0.12mm
Lead free soldering: Lead Free

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Contact Information

Contact: Kevin

Mobile: 15818784205 WeChat Same Number Q392870937

Fixed line: 0755-29511989

E-mail: Kevin@gljmconn.com

Http:www.gljmconn.com

Contact: Wu Yun

Mobile: 15811820797 WeChat Same Number QQ907120966

Fixed line: 0755-29511989

E-mail: gordon@gljmconn.com

Contact: Wu Tingfu

Mobile: 15188312169 WeChat Same Number QQ706592397

Fixed line: 0755-29511989

Address: 2-3F, Building D, Xinsheng Science and Technology Park, No. 2 Longshan 5th Road, Longgang Street, Longgang District, Shenzhen